Difference between revisions of "Tool List"

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(Dry Etch)
(added S-Cubed Flexi to Wet processing tools as well)
 
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__NOTOC__
 
__NOTOC__
 
=Lithography=
 
=Lithography=
  +
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
  +
=====Photoresists and Lithography Chemicals=====
* [[Suss Aligners (SUSS MJB-3)]]
 
  +
* [[IR Aligner (SUSS MJB-3 IR)]]
 
  +
*See the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
* [[DUV Flood Expose]]
 
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
* [[Ovens 1, 2 & 3 (Labline)]]
 
  +
* [[Oven 4 (Fisher)]]
 
  +
=====Contact Aligners (Optical Exposure)=====
* [[Oven 5 (Labline)]]
 
  +
* [[High Temp Oven (Blue M)]]
 
* [[Vacuum Oven (YES)]]
+
*[[Suss Aligners (SUSS MJB-3)]]
  +
*[[IR Aligner (SUSS MJB-3 IR)]]
* [[Holographic Lith/PL Setup (Custom)]]
 
  +
*[[Contact Aligner (SUSS MA-6)]]
|width=400|
 
* [[Stepper 1 (GCA 6300)]]
+
*[[DUV Flood Expose]]
  +
* [[Stepper 2 (AutoStep 200)]]
 
  +
=====Other Patterning Systems=====
* [[Stepper 3 (ASML DUV)]]
 
  +
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
 
  +
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
* [[Nano-Imprint (Nanonex NX2000)]]
 
* [[Contact Aligner (SUSS MA-6)]]
+
*[[Nano-Imprint (Nanonex NX2000)]]
  +
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
  +
| width="400" |
  +
=====Steppers (Optical Exposure)=====
  +
  +
*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
  +
*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
  +
*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
  +
  +
=====Thermal Processing for Photolithography=====
  +
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]]
  +
*[[Ovens 1, 2 & 3 (Labline)]]
  +
*[[Oven 4 (Fisher)]]
  +
*[[Oven 5 (Labline)]]
  +
*[[High Temp Oven (Blue M)]]
  +
*[[Vacuum Oven (YES)]]
  +
*The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
 
|-
 
|-
 
|}
 
|}
   
= Vacuum Deposition =
+
=Vacuum Deposition=
   
 
{|
 
{|
 
|- valign="top"
 
|- valign="top"
| width="300" |
+
| width="300" |
  +
=====Physical Vapor Deposition (PVD)=====
*[[E-Beam 1 (Sharon)]]
 
*[[E-Beam 2 (Custom)]]
 
*[[E-Beam 3 (Temescal)]]
 
*[[E-Beam 4 (CHA)]]
 
*[[Sputter 2 (SFI Endeavor)]]
 
*[[Sputter 3 (AJA ATC 2000-F)]]
 
*[[Sputter 4 (AJA ATC 2200-V)]]
 
*[[Sputter 5 (Lesker AXXIS)]]
 
   
  +
*[[E-Beam 1 (Sharon)]]
| width="400" |
 
*[[PECVD 1 (PlasmaTherm 790)]]
+
*[[E-Beam 2 (Custom)]]
*[[PECVD 2 (Advanced Vacuum)]]
+
*[[E-Beam 3 (Temescal)]]
*[[Thermal Evap 1]]
+
*[[E-Beam 4 (CHA)]]
*[[Thermal Evap 2 (Solder)]]
+
*[[Thermal Evap 1]]
*[[ICP-PECVD (Unaxis VLR)]]
+
*[[Thermal Evap 2 (Solder)]]
  +
*[[Ion Beam Deposition (Veeco NEXUS)]]
 
*[[Molecular Vapor Deposition]]
+
=====Sputter Deposition=====
  +
*[[Atomic Layer Deposision (Oxford FlexAL)]]
 
  +
*[[Sputter 3 (AJA ATC 2000-F)]]
  +
*[[Sputter 4 (AJA ATC 2200-V)]]
  +
*[[Sputter 5 (AJA ATC 2200-V)]]
  +
*[[Ion Beam Deposition (Veeco NEXUS)]]
  +
  +
| width="400" |
  +
=====Chemical Vapor Deposition (CVD)=====
  +
  +
*[[PECVD 1 (PlasmaTherm 790)]]
  +
*[[PECVD 2 (Advanced Vacuum)]]
  +
*[[ICP-PECVD (Unaxis VLR)]]
  +
*[[Molecular Vapor Deposition]]
  +
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
   
 
|}
 
|}
   
= Dry Etch =
+
=Dry Etch=
   
 
{|
 
{|
 
|- valign="top"
 
|- valign="top"
| width="300" |
+
| width="300" |
  +
=====Reactive Ion Etching (RIE)=====
*[[RIE 2 (MRC)]]
 
  +
*[[RIE 3 (MRC)]]
 
*[[RIE 5 (PlasmaTherm)]]
+
*[[RIE 2 (MRC)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
+
*[[RIE 3 (MRC)]]
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)]]
+
*[[RIE 5 (PlasmaTherm)]]
*[[Ashers (Technics PEII)]]
+
*[[Ashers (Technics PEII)]]
*[[UV Ozone Reactor]]
+
*[[Plasma Clean (Gasonics 2000)]]
*[[CAIBE (Oxford Ion Mill)]]
+
*[[Plasma Clean (YES EcoClean)]]
  +
*[[Plasma Activation (EVG 810)]]
| width="400" |
 
*[[ICP Etch 1 (Panasonic E626I)]]
+
*[[CAIBE (Oxford Ion Mill)]]
  +
*[[ICP Etch 2 (Panasonic E640)]]
 
  +
=====Etch Monitoring=====
  +
  +
*[[Laser Etch Monitoring]] (Endpoint Detection)
  +
*Optical Emission Spectra
  +
*Residual Gas Analyzer (RGA)
  +
| width="400" |
  +
=====ICP-RIE=====
  +
  +
*[[ICP Etch 1 (Panasonic E626I)]]
  +
*[[ICP Etch 2 (Panasonic E640)]]
 
*[[ICP-Etch (Unaxis VLR)]]
 
*[[ICP-Etch (Unaxis VLR)]]
  +
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
*[[Plasma Clean (Gasonics 2000)]]
 
  +
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
 
  +
*[[Plasma Activation (EVG 810)]]
 
  +
=====Other Dry Etching=====
  +
  +
*[[UV Ozone Reactor]]
  +
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
 
*[[Vapor HF Etch]]
 
*[[Vapor HF Etch]]
   
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=Wet Processing=
 
=Wet Processing=
  +
See the [[Chemical List|Chemical List page]] for stocked chemicals such as Developers, Etchants, Solvents etc.
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
* [[Wet Benches]]
+
*[[Wet Benches]]
 
**[[Solvent Cleaning Benches]]
 
**[[Solvent Cleaning Benches]]
 
**[[Spin Coat Benches]]
 
**[[Spin Coat Benches]]
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**[[HF/TMAH Processing Benches]]
 
**[[HF/TMAH Processing Benches]]
 
**[[Plating Bench]]
 
**[[Plating Bench]]
|width=400|
+
| width="400" |
* [[Gold Plating Bench]]
+
*[[Gold Plating Bench]]
* [[Critical Point Dryer]]
+
*[[Critical Point Dryer]]
* [[Spin Rinse Dryer (SemiTool)]]
+
*[[Spin Rinse Dryer (SemiTool)]]
* [[Chemical-Mechanical Polisher (Logitech)]]
+
*[[Chemical-Mechanical Polisher (Logitech)]]
  +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
 
|-
 
|-
 
|}
 
|}
   
 
=Thermal Processing=
 
=Thermal Processing=
  +
{|
* [[Rapid Thermal Processor (AET RX6)]]
 
  +
|- valign="top"
* [[Strip Annealer]]
 
  +
| width="400" |
* [[Tube Furnace (Tystar 8300)]]
 
  +
*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
 
  +
*[[Rapid Thermal Processor (SSI Solaris 150)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
 
* [[Wafer Bonder (SUSS SB6-8E)]]
+
*[[Tube Furnace (Tystar 8300)]]
* [[Ovens 1, 2 & 3 (Labline)]]
+
*[[Tube Furnace Wafer Bonding (Thermco)]]
  +
*[[Tube Furnace AlGaAs Oxidation (Lindberg)]]
* [[Oven 4 (Fisher)]]
 
* [[Oven 5 (Labline)]]
+
*[[Wafer Bonder (SUSS SB6-8E)]]
  +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
* [[High Temp Oven (Blue M)]]
 
  +
| width="400" |
* [[Vacuum Oven (YES)]]
 
  +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
  +
**[[Ovens 1, 2 & 3 (Labline)]]
  +
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
  +
**[[Oven 5 (Labline)]]
  +
**[[Vacuum Oven (YES)]]
  +
**[[High Temp Oven (Blue M)]]
  +
|-
  +
|}
   
 
=Packaging=
 
=Packaging=
  +
* [[Dicing Saw (ADT)]]
 
* [[Flip-Chip Bonder (Finetech)]]
+
*[[Dicing Saw (ADT)]]
  +
*[[Flip-Chip Bonder (Finetech)]]
* [[Vacuum Sealer]]
 
* [[Wire Saw (Takatori)]]
+
*[[Vacuum Sealer]]
  +
*[[Wire Saw (Takatori)]]
   
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
  +
=====Optical/Electron Microscopy=====
* [[Field Emission SEM 1 (FEI Sirion)]]
 
  +
* [[Field Emission SEM 2 (JEOL 7600F)]]
 
  +
*[[Microscopes|Optical Microscopes]]
* [[Step Profile (Dektak IIA)]]
 
* [[Step Profilometer (Dektak 6M)]]
+
*[[Fluorescence Microscope (Olympus MX51)]]
  +
*[[Deep UV Optical Microscope (Olympus)]]
* [[Ellipsometer (Rudolph)]]
 
  +
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
* [[Microscopes]]
 
  +
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
* [[Probe Station & Curve Tracer]]
 
* [[Optical Film Thickness (Filmetrics)]]
+
*[[Field Emission SEM 1 (FEI Sirion)]]
* [[Optical Film Thickness (Nanometric)]]
+
*[[Field Emission SEM 2 (JEOL 7600F)]]
  +
*[[SEM Sample Coater (Hummer)]]
* [[Goniometer]]
 
  +
|width=400|
 
  +
=====Topographical Metrology=====
* [[Film Stress (Tencor Flexus)]]
 
  +
* [[SEM Sample Coater (Hummer)]]
 
* [[Surface Analysis (KLA/Tencor Surfscan)]]
+
*[[Step Profilometer (KLA Tencor P-7)]]
  +
*[[Step Profilometer (Dektak 6M)]]
* [[Photo-emission & IR Microscope (QFI)]]
 
  +
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
* [[Ellipsometer (Woollam)]]
 
* [[Resistivity Mapper (CDE RESMAP)]]
+
*[[Surface Analysis (KLA/Tencor Surfscan)]]
  +
**''Sub-micron Particle Counter''
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
 
* [[Deep UV Optical Microscope (Olympus)]]
+
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
  +
*[[Optical Profilometer - White-Light/Phase-Shift Interference (Filmetrics Profilm3D)]]
* [[Fluorescence Microscope (Olympus MX51)]]
 
  +
| width="400" |
* [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]]
 
  +
=====Thin-Film Analysis/Measurement=====
  +
  +
*[[Ellipsometer (Woollam)]]
  +
*[[Film Stress (Tencor Flexus)]]
  +
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
  +
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
  +
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
  +
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
  +
*[[Optical Film Thickness (Nanometric)]]
  +
*[[Resistivity Mapper (CDE RESMAP)]]
  +
  +
=====Other Tools=====
  +
  +
*[[Probe Station & Curve Tracer]]
  +
*[[Goniometer]]
  +
*[[Photoluminescence PL Setup (Custom)]]
 
|-
 
|-
 
|}
 
|}

Latest revision as of 15:05, 8 October 2019

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Etch Monitoring
ICP-RIE
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical/Electron Microscopy
Topographical Metrology
Thin-Film Analysis/Measurement
Other Tools