Difference between revisions of "Tool List"

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(Inspection, Test and Characterization: link to Filmetrics F-40-UV page)
(Thermal Processing: link to Logitech wafer bonder)
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* [[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
 
* [[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
 
* [[Strip Annealer]]
 
* [[Strip Annealer]]
  +
* [[High Temp Oven (Blue M)]]
 
* [[Tube Furnace (Tystar 8300)]]
 
* [[Tube Furnace (Tystar 8300)]]
 
* [[Tube Furnace Wafer Bonding (Thermco)]]
 
* [[Tube Furnace Wafer Bonding (Thermco)]]
 
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
 
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
* [[Wafer Bonder (SUSS SB6-8E)]]
 
 
| width="400" |
 
| width="400" |
 
* [[Ovens 1, 2 & 3 (Labline)]]
 
* [[Ovens 1, 2 & 3 (Labline)]]
 
* [[Oven 4 (Fisher)]]
 
* [[Oven 4 (Fisher)]]
 
* [[Oven 5 (Labline)]]
 
* [[Oven 5 (Labline)]]
* [[High Temp Oven (Blue M)]]
 
 
* [[Vacuum Oven (YES)]]
 
* [[Vacuum Oven (YES)]]
  +
* [[Wafer Bonder (SUSS SB6-8E)]]
  +
* [[Wafer Bonder (Logitech WSB2)|Wafer Bonder/Wax Mounting (Logitech WSB2)]]
 
|-
 
|-
 
|}
 
|}

Revision as of 10:54, 22 August 2018

Lithography

You can see our available photoresists on the Chemical Datasheets page.

Contact Aligners (Optical Exposure)
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
ICP-RIE
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical/Electron Microscopy
Topographical Metrology
Thin-Film Analysis/Measurement
Other Tools