Difference between revisions of "Tool List"

From UCSB Nanofab Wiki
Jump to: navigation, search
(Dry Etch: categories)
m (Thermal Processing: tabled)
Line 109: Line 109:
   
 
=Thermal Processing=
 
=Thermal Processing=
  +
{|
* [[Rapid Thermal Processor (AET RX6)]]
 
  +
|- valign="top"
  +
|- align="left"
  +
!
  +
* [[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
 
* [[Strip Annealer]]
 
* [[Strip Annealer]]
 
* [[Tube Furnace (Tystar 8300)]]
 
* [[Tube Furnace (Tystar 8300)]]
Line 115: Line 119:
 
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
 
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
 
* [[Wafer Bonder (SUSS SB6-8E)]]
 
* [[Wafer Bonder (SUSS SB6-8E)]]
  +
!
 
* [[Ovens 1, 2 & 3 (Labline)]]
 
* [[Ovens 1, 2 & 3 (Labline)]]
 
* [[Oven 4 (Fisher)]]
 
* [[Oven 4 (Fisher)]]
Line 120: Line 125:
 
* [[High Temp Oven (Blue M)]]
 
* [[High Temp Oven (Blue M)]]
 
* [[Vacuum Oven (YES)]]
 
* [[Vacuum Oven (YES)]]
  +
|-
  +
|}
   
 
=Packaging=
 
=Packaging=
Line 128: Line 135:
   
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
  +
{|
{| class="wikitable"
 
 
|- valign="top"
 
|- valign="top"
 
| width="300" |
 
| width="300" |

Revision as of 22:09, 3 July 2018

Lithography

You can see our available photoresists on the Chemical Datasheets page.

Contact Aligners (Optical Exposure)
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
ICP-RIE
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical/Electron Microscopy
Topographical Metrology
Thin-Film Analysis/Measurement
Other Tools