Difference between revisions of "Tool List"

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(Vacuum Deposition: categories)
(Dry Etch: categories)
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===== Reactive Ion Etching (RIE) =====
 
*[[RIE 2 (MRC)]]
 
*[[RIE 2 (MRC)]]
 
*[[RIE 3 (MRC)]]
 
*[[RIE 3 (MRC)]]
 
*[[RIE 5 (PlasmaTherm)]]
 
*[[RIE 5 (PlasmaTherm)]]
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]
 
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)]]
 
 
*[[Ashers (Technics PEII)]]
 
*[[Ashers (Technics PEII)]]
*[[UV Ozone Reactor]]
+
*[[Plasma Clean (Gasonics 2000)]]
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*[[Plasma Activation (EVG 810)]]
 
*[[CAIBE (Oxford Ion Mill)]]
 
*[[CAIBE (Oxford Ion Mill)]]
| width="400" |
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| width="400" |
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===== ICP-RIE =====
 
*[[ICP Etch 1 (Panasonic E626I)]]
 
*[[ICP Etch 1 (Panasonic E626I)]]
 
*[[ICP Etch 2 (Panasonic E640)]]
 
*[[ICP Etch 2 (Panasonic E640)]]
 
*[[ICP-Etch (Unaxis VLR)]]
 
*[[ICP-Etch (Unaxis VLR)]]
  +
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)|Plasma-Therm SLR: Si Deep RIE (PlasmaTherm/Bosch Etch)]]
*[[Plasma Clean (Gasonics 2000)]]
 
  +
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
  +
  +
===== Other Dry Etching =====
  +
*[[UV Ozone Reactor]]
 
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
 
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
*[[Plasma Activation (EVG 810)]]
 
 
*[[Vapor HF Etch]]
 
*[[Vapor HF Etch]]
   

Revision as of 22:00, 3 July 2018

Lithography

You can see our available photoresists on the Chemical Datasheets page.

Contact Aligners (Optical Exposure)
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
ICP-RIE
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Inspection, Test and Characterization

Optical/Electron Microscopy
Topographical Metrology
Thin-Film Analysis/Measurement
Other Tools