Difference between revisions of "Tool List"

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(Dry Etch)
m (Vacuum Deposition: minor speling)
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=Lithography=
 
=Lithography=
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
 
* [[Suss Aligners (SUSS MJB-3)]]
 
* [[Suss Aligners (SUSS MJB-3)]]
 
* [[IR Aligner (SUSS MJB-3 IR)]]
 
* [[IR Aligner (SUSS MJB-3 IR)]]
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* [[Vacuum Oven (YES)]]
 
* [[Vacuum Oven (YES)]]
 
* [[Holographic Lith/PL Setup (Custom)]]
 
* [[Holographic Lith/PL Setup (Custom)]]
|width=400|
+
| width="400" |
 
* [[Stepper 1 (GCA 6300)]]
 
* [[Stepper 1 (GCA 6300)]]
 
* [[Stepper 2 (AutoStep 200)]]
 
* [[Stepper 2 (AutoStep 200)]]
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*[[Ion Beam Deposition (Veeco NEXUS)]]
 
*[[Ion Beam Deposition (Veeco NEXUS)]]
 
*[[Molecular Vapor Deposition]]
 
*[[Molecular Vapor Deposition]]
*[[Atomic Layer Deposision (Oxford FlexAL)]]
+
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
   
 
|}
 
|}
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=Wet Processing=
 
=Wet Processing=
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
 
* [[Wet Benches]]
 
* [[Wet Benches]]
 
**[[Solvent Cleaning Benches]]
 
**[[Solvent Cleaning Benches]]
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**[[HF/TMAH Processing Benches]]
 
**[[HF/TMAH Processing Benches]]
 
**[[Plating Bench]]
 
**[[Plating Bench]]
|width=400|
+
| width="400" |
 
* [[Gold Plating Bench]]
 
* [[Gold Plating Bench]]
 
* [[Critical Point Dryer]]
 
* [[Critical Point Dryer]]
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=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
 
{|
 
{|
|-valign="top"
+
|- valign="top"
|width=300|
+
| width="300" |
 
* [[Field Emission SEM 1 (FEI Sirion)]]
 
* [[Field Emission SEM 1 (FEI Sirion)]]
 
* [[Field Emission SEM 2 (JEOL 7600F)]]
 
* [[Field Emission SEM 2 (JEOL 7600F)]]
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* [[Optical Film Thickness (Nanometric)]]
 
* [[Optical Film Thickness (Nanometric)]]
 
* [[Goniometer]]
 
* [[Goniometer]]
|width=400|
+
| width="400" |
 
* [[Film Stress (Tencor Flexus)]]
 
* [[Film Stress (Tencor Flexus)]]
 
* [[SEM Sample Coater (Hummer)]]
 
* [[SEM Sample Coater (Hummer)]]

Revision as of 09:58, 15 November 2017

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization