Use this process for producing a 1-monolayer thick sticking layer on a surface prior to lithography. This material was designed to improve sticking of resist polymers to silicon oxide.
  1. Clean sample using appropriate lithography cleaning procedure.
  2. Set chuck spin speed to 4 krpm.
  3. Place sample on spinner chuck and pull vacuum.
  4. Coat wafer with HMDS using pipette.
  5. Let HMDS sit in a puddle on the surface for 20 seconds. This is necessary to allow the surface reaction to complete.
  6. Spin sample dry.
  7. Alternatively, place a small open beaker of HMDS along with your sample into an enclosed container and let sit for 20 minutes. This is a vapor coating technique.
  8. To remove an HMDS film, use oxygen plasma or UV-Ozone.