The UCSB nanofabrication facility offers a wide spectrum of tools for your research needs.

 

Listed below is a broad overview of our capabilities.

 

Remote processing is also available.

 

If you would like to investigate other processing or characterization possibilities for your project, please contact one of the following individuals to initiate the request:

Brian Thibeault:

This email address is being protected from spambots. You need JavaScript enabled to view it., (805) 893-2268

Tom Reynolds:

This email address is being protected from spambots. You need JavaScript enabled to view it., (805) 893-3918 ext. 215

 

Claudia Gutierrez:
This email address is being protected from spambots. You need JavaScript enabled to view it., (805) 893-7989

 

Lithography

E-beam Lithography: JEOL 6300FS

  • Resolution to 8 nm
  • 20 nm resolution in 500 um x 500 um field

Optical Lithography

  • Holography ≈ 200 nm
  • Projection Stepper ≈ 400 nm resolution; 150 nm registration
  • Contact Lithography (backside capability)

Nanoimprint Lithography

  • Thermal process to 200°C; 600 psi
  • UV curing
Thin Film Deposition

E-beam and Thermal Evaporation

  • Ai, Ti, Al, Au, Ni, Pd, Pt, Ag, Ge, Zn, W, Ta
  • Dielectric: SiO2, SrF, MgO, Ti O2, Ta2O5, SiO
  • Other materials are possible

PECVD

  • SiO2, SiON, Si3N4, a-Si

Sputtering

  • Si, Co, Ni, Ti, W, Au, Al, ITO, SiO2, SiN, TiO2, AlN, Al2O3
  • Other materials are possible

ALD

  • Al2O3, HfO2, ZrO2, TiO2, SiO2, AlN, HfN, TiN
Dry Etching

CH4, H2, Ar RIE

  • II-VI etching
  • III-V electronic/optoelectronic devices

SF6, CHF3, CF4, O2, Ar RIE/ICP

  • General silicon, oxide, and nitride etch
  • Separate Bosch Si etch Silicon Carbides for MEMS
  • Call about special materials.

BCl3, Cl2, SiCI4, O2 Ar RIE/ICP

  • General semiconductor and metal
  • III-V etching with heated chuck for InP
  • Call about special materials.

XeF2 etching of Silicon and Germanium

Thin Film Characterization
  • SEM: FEI Sirion, JEOL7600
  • Profilometry
  • Spectroscopic Ellipsometry
  • Reflectometry
  • Probe Station with Curve Tracer
  • 4-Point Resistivity Mapping
  • Film Stress Measurement
  • AFM

 

Other Processes
  • Contact Annealing
  • Wet Chemical Etching
  • Critical Point Drying
  • Rapid Thermal Annealing
    • 1200°C in N2, H2N2, dry air
    • III-V, Si, other materials
  • Flip-chip Bonding
  • Wafer Bonding to 600°C
  • Molecular Vapor Deposition
Other Resources

Facility users will benefit by having access to multiple labs on campus to perform their research.  The list of Mult-User Labs can be found at the following website:

 http://www.bfs.ucsb.edu/procurement/contracts-property/multi-user-lab-access

 

Equipment Status
  • GCA Autostep Maintenance Sept 23 - Sept 25
    18 September 2019

    3C Technical will be here to service the GCA Autostep from Monday September 23 thru Wednesday September 25. The service will begin at 8:00am Monday morning, and will conclude by 6:00pm Wednesday. Silva 10:36, 18 September 2019 (PDT)

  • GCA 6300 Maintenance Sept 26
    18 September 2019

    3C Technical will be here to service the GCA 6300 on Thursday September 26. The service will begin at 8:00am Thursday morning, and will finish by 6:00pm that day. Silva 10:36, 18 September 2019 (PDT)

  • ASML Stepper: Maintenance Sept 30 - Oct 4
    18 September 2019

    ASML will be performing quarterly maintenance from Monday Sept. 30th to Friday Oct. 4th, please plan for the tool to be down during this time. // John d 08:39, 18 September 2019 (PDT)

  • Suss Bonder
    13 September 2019

    Suss Bonder is DOWN. The vendor installed all the hardware but failed to get the software to work. The vendor will be back sometime next week, the week of the 16th, to complete the repair/upgrade. Silva 15:59, 13 September 2019 (PDT)


  • Logitech Wafer Bonder: Down
    12 September 2019

    There's an issue with the heater and chamber assembly, awaiting replacement parts for the repair. Estimate 3 weeks to receive the replacement part. Silva 09:42, 12 September 2019 (PDT)