 The USCB nanofabrication facility offers a wide spectrum of tools for your research needs.
Listed below is a broad overview of our capabilities. Click here for more details about our equipment. Remote processing is also available. If you would like to investigate other processing or characterization possibilities for your project, please contact:
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at (805) 893-8174
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at (805) 893-2268
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E-beam Lithography - Brand New JEOL 6300FS
- Resolution to 8nm
- 20 mn resolution in 500 um x 500 um field
Optical Lithography - Holography ≈ 200 nm
- Projection Stepper ≈ 400 nm resolution; 150 nm registration
- Contact Lithography (backside capability)
Nanoimprint Lithography - Thermal process to 200°C; 600 psi
- UV curing
| E-beam and Thermal Evaporation - Ai, Ti, Al, Au, Ni, Pd, Pt, Ag, Ge, Zn, W, Ta
- Dielectric: SiO2, SrF, MgO, Ti O2, Ta2O5, SiO
- Other materials are possible
PECVD Sputtering - Si, Co, Ni, Ti, W, Au, Al, ITO, SiO2, SiN, TiO2, AlN, Al2O3
- Other materials are possible
| CH4, H2, Ar RIE - II-VI etching
- III-V electronic/optoelectronic devices
SF6, CHF3, CF4, O2, Ar RIE/ICP - General silicon, oxide, and nitride etch
- Separate Bosch Si etch Silicon Carbides for MEMS
- Call about special materials.
BCl3, Cl2, SiCI4, O2 Ar RIE/ICP - General semiconductor and metal
- III-V etching with heated chuck for InP
- Call about special materials.
| Thin Film Characterization - SEM
- FESEM
- Profilometer
- Ellipsometer
- Reflectometer
- Probe Station with Curve Tracer
- AFM
| Other Processes - Contact Annealing
- Wet Chemical Etching
- Critical Point Drying
- Rapid Thermal Annealing
- 1200°C in N2, H2N2, dry air
- III-V, Si, other materials
- Flip-chip Bonding
- Wafer Bonding to 600°C
| Other Resources Facility users will benefit from the strong internal program in
materials research and characterization at UCSB, through the
user-accessible Materials Research Labs (MRL)*. Materials Characterization capabilities include: - Atomic Force Microscopy
- Scanning Electron Microscopy
- Transmission Electron Microscopy
- Photoluminescence Spectroscopy
- X-ray Diffraction
- Scanning Auger Microscopy
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