Oxford FlexAL Atomic Layer Deposition System

Oxford FlexAL Atomic Layer Deposition System

Equipment Description:
Oxford FlexAL Atomic Layer Deposition System

Model:
FlexAL

Manufacturer:
Oxford Instruments Plasma Technologies
21001 San Ramon Valley Blvd., #A4-160,
San Ramon, CA 94583
Telephone: 925-803-4177
www.oxford-instruments.com

 

 

 

General Information and Usage:

The Oxford Instruments FlexAL Atomic Layer Deposition system at UCSB is a plasma-enhanced ALD system for the precise growth of ultra-thin oxides and nitrides. Self-limiting layer by layer growth ensures precise control, film conformality, and repeatability of the films. The system currently has metallorganic precursors for Aluminum, Hafnium, Zirconium, and Silicon oxides and nitrides. Water is available for thermal oxides and Oxygen, Nitrogen, and Hydrogen are available for plasma assisted oxides and nitrides. Remote ICP plasma powers up to 600W are possible. The system is load-locked and can accommodate sample temperatures up to 550°C. Processing temperature windows are defined for each material based on growth limitations. The system is step-by-step programmable through a flexible GUI interface. In-situ ellipsometry between growth cycles and mass spectrometry during growth are both available.

 

Contact Information:

For additional information regarding the Oxford FlexAL Atomic Layer Deposition System or if you would like to inquire about using the UCSB Nanofabrication Facility, please contact This email address is being protected from spambots. You need JavaScript enabled to view it.  using the telephone number or e-mail address below. 


This email address is being protected from spambots. You need JavaScript enabled to view it.
Phone: (805) 893-3918 ext. 210
E-Mail: This email address is being protected from spambots. You need JavaScript enabled to view it.

 

Technical and educational staff services are possible through the generosity of the National Science Foundation through support via the NNIN.