Wafer Fusion Furnace

wafer fusion furnaceEquipment Description:
Wafer Fusion Furnace

Manufacturer and Model:
Glove Box: ATC Nexus One Control
Furnace: Thermco Mini-Brute MB-80

 

 

 

 

 

 

 

General Information and Usage:

This wafer fusion furnace is a custom built unit designed for the fusion of different material types (such InP and Si) to create new heterostructures for novel electronic and optoelectronic devices. Custom made bonding fixtures are loaded into the furnace through a purged glove-box that is oxygen free to below 10 ppm with a dew point near -80°C. The furnace is nitrogen purged and can operate up from 200°C to 1200°C. Many different materials are allowed and maximum temperature is dependent on the materials themselves, to avoid contamination of the furnace.

 

Equipment Specifications:

  • Temperatures 200°C to 1200°C
  • 4 inch diameter furnace
  • Nitrogen ambient at atmospheric pressure
  • Oxygen control in glove box to less than 10 ppm
  • Dew point near -80°C
  • Custom bonding fixtures of various materials allowed

 

Contact Information:

For additional information regarding the wafer fusion furnace or if you would like to inquire about using the UCSB Nanofabrication Facility, please contact This email address is being protected from spambots. You need JavaScript enabled to view it.  using the telephone number or e-mail address below. 

 

This email address is being protected from spambots. You need JavaScript enabled to view it.

Phone: (805) 893-3918 ext. 219
E-Mail: This email address is being protected from spambots. You need JavaScript enabled to view it.

 

Technical and educational staff services are possible through the generosity of the National Science Foundation through support via the NNIN.