Karl-Suss SB-6 Wafer Bonder

wafer bonder 3wafer bonder wafer bonder 2

Equipment Description:
Karl Suss Substrate Bonder

Manufacturer:
Karl Suss America, Inc.
P.O. Box 157
Suss Drive
Waterbury Center, Vt. 05677
Phone: (802) 244-5181
Fax: (802) 244-5103

Model:
SB-6

 

 

 

General Information and Usage:

This is Karl-Suss model SB-6 substrate bonder. Wafer bonding of pieces to 6” wafers can be done at pressures from 5e-5 to 3e3 mBar and from 50°C to 550°C. This tool mates with the Karl-Suss MA-6 aligner to allow for aligned bonding. Forces up to 20 kN for a 150 mm wafer size are available. The system supports thermal compression as well as anodic bonding (up to 2000 V). The system is computer controlled with a windows environment allowing for multiple recipe steps and saving of recipes and data. The system is configured for manual loading of wafers.

 

Equipment Specifications:

  • Wafer bonding from 50°C to 550°C, +/- 5 degrees accuracy, +/- 3% uniformity
  • Upper and lower heating of samples
  • 5e-5 to 3e3 Torr environment bonding pressure, with Nitrogen
  • Sample size: pieces to 6” wafers, aligned bonding by using MA/BA-6 aligner
  • Anodic bonding to 2000 V
  • Windows-based computer control

 

Contact Information:

For additional information regarding the Karl Suss SB-6 Wafer Bonder or if you would like to inquire about using the UCSB Nanofabrication Facility, please contact This email address is being protected from spambots. You need JavaScript enabled to view it.  using the telephone number or e-mail address below. 

 

This email address is being protected from spambots. You need JavaScript enabled to view it.

Phone: (805) 893-3918 ext. 216
E-Mail: This email address is being protected from spambots. You need JavaScript enabled to view it.

 

Technical and educational staff services are possible through the generosity of the National Science Foundation through support via the NNIN.