Three-Target DC/RF Sputtering System

sputter

Equipment Description:
Three-Target DC/RF Sputtering System

Manufacturer:
Sputtered Films, Inc.
320 Nopal St.
Santa Barbara, CA 93103
Phone: (805) 963-9651
Fax: (805) 963-2959

 

 

 

 

 

General Information and Usage:

The Three-Target DC/RF Sputtering System, built by Sputtered Films, Inc. is based on the "Research S-Gun" and as such, is capable of high sputtering rates (~ A/min.) for metal, semiconductor and dielectric materials with a minimal substrate bombardment caused by secondary electrons. The deposition chamber is non-loadlocked providing for easy sample loading and target/gun changing. Venting and evacuation are automated with a 500 l/s turbo (capable of pumping O2) achieving an ~ 2 E-7 T ultimate pressure (~ 1E-7 with liquid nitrogen flange pocket) in about 6-8 hours. Substrates are clip mounted onto one of several 6 inch diameter platens which mount into a rotating 4-position planetary "flat-wheel". This flat-wheel is concentric with a rotating 3-blade shutter assembly. Each are then manually positioned over one of three sputtering guns, operating one at a time. Available gases for injection include Ar/N2/O2, the latter allowing for nitride and oxide formation. Flow rates of <100 sccm are controlled with standard mass flow controllers. Gun power supplies include: 2.4 kW DC magnetron driver, 13.56 Mhz RF supply for sample sputter cleaning, and a SparcLE Pulsed DC Unit for reactive sputter deposition. Operation is usually in a constant power mode (200-500 watts) with the resulting optimum V, I (and chamber pressure) dependent on the target material. Present available targets include: Al, Al(0.5% Cu or 4% Cu), Ag, Au, Cr, ITO, Nb, Si, Ti, W, W-Si and Zr-Y.

 

Detailed Specifications:

  • 3 target with DC or Pulsed-DC operation
  • Low E-7 T ultimate pressure (10 mT typical operating pressure)
  • 6" diameter sample holder platen with 4" sample-gun spacing
  • Deposition uniformity is ~ 85% over 2 " diameter for SiO2 deposition at 300W

 

Contact Information:

For additional information regarding the Three-Target DC/RF Sputtering System or if you would like to inquire about using the UCSB Nanofabrication Facility, please contact This email address is being protected from spambots. You need JavaScript enabled to view it.  using the telephone number or e-mail address below. 

 

This email address is being protected from spambots. You need JavaScript enabled to view it.

Phone: (805) 893-3918 ext. 213

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Technical and educational staff services are possible through the generosity of the National Science Foundation through support via the NNIN.