Film Stress Measurement

film stress measurement system

Equipment Description:
Film Stress Measurement system

Model:
Flexus 2320

Manufacturer:
Tencor

 

 

 

 

 

General Information and Usage:

The Flexus instrument is used to measure the stress introduced onto a wafer after thin-film deposition by measuring local curvature of a wafer. The system uses a scanning laser detector configuration to measure the surface position of a wafer across its diameter. With automatic rotational control, a 3-D map can also be obtained. By comparing before and after measurements of the sample, the local stress of the sample can be calculated from the local curvature. The stage can also be heated up to 500°C to measure thermal mismatch of the thin films with the substrate.

 

Detailed Specifications:

  • RT to 500°C operation
  • Windows 3.xx control and file storing
  • 3-D mapping
  • 4" wafers
  • Laser/Detector Scanning Configuration

 

Contact Information:

For additional information regarding the Flexus or if you would like to inquire about using the UCSB Nanofabrication Facility, please contact This email address is being protected from spambots. You need JavaScript enabled to view it.  using the telephone number or e-mail address below. 


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Phone: (805) 893-3918 ext. 219
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Technical and educational staff services are possible through the generosity of the National Science Foundation through support via the NNIN.