EVG Plasma Activation System

EVG Plasma Activation System

Equipment Description:
Plasma Surface Activation

Manufacturer:
EVG Group

 

 

 

 

 

 

 

 

General Information and Usage:

This a capacitively coupled Oxygen plasma activation system used exclusively for the surface activation of clean surfaces prior to wafer bonding. This technique allows bonding temperatures to be lowered and is used as a companion tool to the Karl-Suss SB6 wafer bond tool.

 

Detailed Specifications:

  • Gases used: O2 and N2
  • Sample size: pieces to 6” wafer

 

Contact Information:

For additional information regarding the EVG system or if you would like to inquire about using the UCSB Nanofabrication Facility, please contact This email address is being protected from spambots. You need JavaScript enabled to view it.  using the telephone number or e-mail address below. 


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Phone: (805) 893-3918 ext. 208
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Technical and educational staff services are possible through the generosity of the National Science Foundation through support via the NNIN.