Technician Internships in Nano-Technology (TINT)
Description
The purpose of this program is to introduce undergraduate students to techniques in nanofabrication and characterization. Applicants should be undergraduate students who are interested in entering the nanotechnology workforce. Generally speaking, these internships are in collaboration with international educational institutions. Students chosen for this position will work with advanced thin film and semiconductor fabrication equipment under guidance of engineers and researchers. No experience is necessary. Training will be provided. Regular reports and final reports will be required. This position is 40 hours per week for 6 months and begins in late January or early February. TINT pays a stipend of $7500 for 6 months, or $1250/month.
Eligibility
TINT applicants are chosen by Nanotech staff. Applicants must have completed at least 2 years of community college, trade school, or university, and have completed at least one year of Physics. Applicants must have a GPA of 2.5 or better. Overall GPA is considered, but it is not as important as math and science grades. Rather, Nanotech staff will evaluate each application—a combination of grades, application questions, and references. At least one letter of recommendation from a teacher is required. Recommendations may be emailed.
Applying to this program
If you are interested in applying to this program, please contact Jack Whaley (805)893-8174 whaley@ece.ucsb.edu or Brian Thibeault at 805-893-2268 thibeault@ece.ucsb.edu
Student |
School |
Country |
Dates |
Project |
|---|---|---|---|---|
| Timo Sperber | Univ. of Applied Science Ulm | Germany | 3-1-2004 to 8-31-2004 | Characterization and Optimization of the Deep RIE Bosch Process |
| Matthias Wiora | Univ. of Applied Science Ulm | Germany | 9-1-2004 to 2-29-2005 | Wafer Steppers; Magneton Sputtering of Thin Films, and Characterization of Reactive Sputtering of Various Films |
| Markus Bingert | Univ. of Applied Science Ulm | Germany | 3-1-2005 to 8-31-2005 | AC Reactive Sputtering of Aluminum Nitride Thin Films |
| Ian Carlson | Univ. of California, Santa Barbara | USA | 7-1-2005 to 10-31-2005 | Facilitization of a Nanofabrication Laboratory |
| Christian Hoegerle | Univ. of Applied Science Ulm | Germany | 9-1-2005 to 2-28-2006 | Development and Characterization of AFM-based Lithography |
| Thuy Ai Nguyen | Vietnam National University of Ho Chi Minh City | Vietnam | 2-13-2006 to 8-12-2006 | Anodizing Process of Aluminum Thin Films on Silicon Substrate for forming Alumina Template |
| Philipp Schlosser | Univ. of Applied Science Ulm | Germany | 3-1-2006 to 8-31-2006, & 3-1-2007 to 8-31-2007 | Laser Interference Lithography & Pattern Transfer |
| Alex Gmeiner | Univ. of Applied Science Ulm | Germany | 3-1-2006 to 8-31-2006 | |
| Michael Schnuerle | Univ. of Applied Science Ulm | Germany | 9-1-2006 to 2-28-2007 | Overview of Processes and Deposition of Amorphous Si |
| Manuel Koch | Univ. of Applied Science Ulm | Germany | 9-1-2006 to 2-28-2007 | Lithography Materials and Ion Beam Deposition |
| Sebastian Valet | Univ. of Applied Science Ulm | Germany | 3-1-2007 to 8-31-2007 | Photoresist Characterization for Stepper |
| Bernd Klein | Univ. of Applied Science Ulm | Germany | 9-1-2007 to 3-1-2008 |

