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Nanotech—The UCSB Nanofabrication Facility           Complementing your research tools, supporting your research needs

 
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The USCB nanofabrication facility offers a wide spectrum of tools for your research needs.

Listed below is a broad overview of our capabilities. Click here for more details about our equipment.

Remote processing is also available.

If you would like to investigate other processing or characterization possibilities for your project, please contact:

Jack Whaley at (805)893-8174 whaley@ece.ucsb.edu

Brian Thibeault at (805)893-2268 thibeault@ece.ucsbedu

Capabilities

LithographyE-beam Lithography

  • Brand New JEOL 6300FS
  • Resolution to 8nm
  • 20mn resolution in 500um x 500um field

Optical Lithography

  • Holography ≈ 200 nm
  • Projection Stepper ≈ 400 nm resolution; 150 nm registration
  • Contact Lithography (backside capability)

Nanoimprint Lithography

  • Thermal process to 200 degrees Celsius; 600 psi
  • UV curing

Thin Film Deposition E-beam and Thermal Evaporation

  • Ai, Ti, Al, Au, Ni, Pd, Pt, Ag, Ge, Zn, W, Ta
  • Dielectric: SiO2, SrF, MgO, Ti O2, Ta2O5, SiO
  • Other materials are possible

PECVD

  • SiO2, SiON, Si3N4

Sputtering

  • Si, Co, Ni, Ti, W, Au, Al, ITO, SiO2, SiN, TiO2, AlN, Al2O3
  • Other materials are possible

Dry Etching CH4, H2, Ar  RIE

  • II-VI etching
  • III-V electronic/optoelectronic devices

SF6, CHF3, CF4, O2, Ar RIE/ICP

  • General silicon, oxide, and nitride etch
  • Separate Bosch Si etch Silicon Carbides for MEMS
  • Call about special materials.

BCl3, Cl2, SiCI4, O2 Ar RIE/ICP

  • General semiconductor and metal
  • III-V etching with heated chuck for InP
  • Call about special materials.

Thin Film Characterization

  • SEM
  • FESEM
  • Profilometer
  • Ellipsometer
  • Reflectometer
  • Probe Station with Curve Tracer
  • AFM

Other Processes

  • Contact Annealing
  • Wet Chemical Etching
  • Critical Point Drying
  • Rapid Thermal Annealing
    • 1200°C in N2, H2N2, dry air
    • III-V, Si, other materials
  • Flip-chip Bonding
  • Wafer Bonding to 600° Celcius

Other Resources

Facility users will benefit from the strong internal program in materials research and characterization at UCSB, through the user-accessible Materials Research Labs (MRL)*.

Materials Characterization capabilities include:

  • Atomic Force Microscopy
  • Scanning Electron Microscopy
  • Transmission Electron Microscopy
  • Photoluminescence Spectroscopy
  • X-ray Diffraction
  • Scanning Auger Microscopy

 
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